Details
Features:
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
Product Parameters:
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Packing list:
Low temperature solder paste *1
Low temperature solder paste *1
Copyright©2018 datacaciques
Top & Fast Shipping！
Get The Right At The Right Price！
Solder Flux Paste Low Temperature Solder Paste Sn42/Bi58 138℃ 30/55g PCB BGA PGA
DESCRIPTION
Features:
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
1.A high viscosity no-clean flux, widely used in PCB, BGA, PGA rework, computer and cell phone chip soldering and rebound.
2.A mixture of high quality alloy powder and resin paste flux to avoid yellowish residue and easy to clean circuit boards.
3. High joint strength and good immersion.
4. Unique formula, perfect performance, easy to weld, bright and full solder joints, no false soldering, fake soldering and so on.
5. Good insulation performance, smooth welding surface, good welding tool.
6.Features of solder paste No pollution, strong viscosity, bright solder joints.
Product Parameters:
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Name: low temperature solder paste
Alloy: Sn42/Bi58 tin powder
Male wire: 25-45um
Melting point: 138°C
Packing: can/tube
Packing list:
Low temperature solder paste *1
Low temperature solder paste *1
SHIPPING
Please Make sure your Ebay Address is 100% right.
We maintain high standards of excellence and strive for 100% customer satisfaction!
Feedback is very important to us. We request that you keep in touch with us immediately BEFORE you give us neutral or negative feedback, so that we can satisfactorily address your concerns.
PAYMENT
Please leave note for your special request (e.g. Colors or Size) in PayPal when you pay the order.
RETURN
Please contact us first if you have any problems/questions/concerns. We will be happy to resolve any issues you may have in a cordial and friendly manner.
---------------------------------------------©Copyright Gogaviinse. All Rights Reserved.--------------------------------------