Shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth. For mobile phones, PC cards and other sophisticated electronic chip-level flux welding.
1, the flux is very effective.
2, IC and PCB for no corrosive.
3, only slightly higher than the boiling point of the melting point of the solder.
Package Included:
1xflux paste
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