4PCS Universal BGA Reballing Stencil For MTK Huawei Xiaomi MSM CPU PM Power IC

Description

  • Feature:
  • These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
  • Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
  • High success rate of planting tin, the solder balls can be formed once when you are proficient.
  • Simple and convenient to use.
  • BGA Reballing Stencil only, other accessories demo in the picture is not included!
  • Specifications:
  • Item Type: BGA Reballing Stencil
  • Material: Stainless Steel
  • Size: Standard Size
  • Color: Silver
  • Quantity: 4PCS
  • Note:
  • No retail package.
  • Transition: 1cm=10mm=0.39inch
  • Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
  • Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes: