4PCS Universal BGA Reballing Stencil For MTK Huawei Xiaomi MSM CPU PM Power IC
Description- Feature:
- These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
- Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
- High success rate of planting tin, the solder balls can be formed once when you are proficient.
- Simple and convenient to use.
- BGA Reballing Stencil only, other accessories demo in the picture is not included!
- Specifications:
- Item Type: BGA Reballing Stencil
- Material: Stainless Steel
- Size: Standard Size
- Color: Silver
- Quantity: 4PCS
- Note:
- No retail package.
- Transition: 1cm=10mm=0.39inch
- Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
- Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes: - 4 x BGA Reballing Stencils