Features：
1. The product has good wettability, strong resistance to dryness, and a relatively long shelf life at room temperature. It is suitable for the mobile phone repair industry, computer digital repair industry, high-precision circuit board SMT welding, BGA process welding, and so on!
2. The solder joints are bright and full without false soldering, with little residue. The solder joints are bright and have strong soldering resistance, good conductivity, and are resistant to oxidation, corrosion, and cleaning; The use of highly efficient thixotropic agents can effectively prevent collapse during printing and preheating, and special soldering flux ensures good printing and fine patterns.
3. High quality, unique formula, perfect performance, easy to solder, bright and full soldering, no false soldering or other phenomena; The residue is colorless and transparent, does not affect the detection, and has excellent washing and cleaning performance.
4. New technical support, unique chemical formula provides excellent wettability, ensuring high reliability. More advanced insulation technology, with long-lasting adhesion and resistance to drying, with a adhesion time of over 48 hours.
5. Features of lead-based solder paste: no cleaning, firm after welding, bright solder joints, not easy to solder, good oxidation resistance, melting point of 183 ℃ (note: the melting point of solder paste refers to reaching the melting temperature, rather than the temperature adjusted by the hot air gun during welding. The specific temperature adjustment depends on the actual welding environment.) Push design, smoother flow, flexible control of tin output, and avoidance of waste. Application scope: Widely used in fields such as circuit boards and integrated circuits. Solder paste for electronic, BGA, and IC welding.

Specifications：

138 ℃ lead-free low-temperature tin slurry
Product melting point: 138 ° C
Scope of application: LED type special heat-resistant plates are not recommended for general products
Features: lead-free, environmentally friendly, low melting point, no tin connection, and not easy to loosen

183 ℃ medium temperature solder paste with lead
Product melting point: 183 ℃
Scope of application: Suitable for basic PCB component repair and welding
Usage characteristics: Strong soldering ability, bright and full solder joints

217 ° C lead-free high-temperature tin slurry
Product melting point: 217 ℃
Scope of application: For use in SMT processes and high-temperature products
Features: lead-free and environmentally friendly, not connected to tin, not easy to loosen, with bright and full tin coating

Package List: solder paste * 1+push rod * 1+needle tube * 1