Product performance:
1. RMA-223 is a moderately active rosin-type solder paste, which is widely used in the SMD rework process of mobile phone boards.
2. For the no-clean solder paste, the color of the residue is very light and has a very high SIR value. It is recommended for BGA, CSP and other ball array solder joint rework and ball filling.
3. Computer motherboard north and south bridge, communications, graphics and other BGA apply.
4. Just apply a little each time.
5. It's currently the best on the market BGA, CSP rework help paste.
6. When the bumping of the BGA chip coated with flux paste and PCB pads are required coat.
7. Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.
8. Capacity: 10cc
9. Tip:Push a finger or a object like a screwdriver into the end to squirt out the paste

Package included:

2/4/10/20/50pcs Soldering Flux Paste