Description
Model:BST-70
Features:
Professional repair tool kit for CPU removal.
Used for BGA repair, removing cell phone CPU chips and cell phone repair.
Stainless steel material, non-deformation, non-stick tin high temperature resistance
Dual head pry knife, five pry knife ten specifications, to meet the de-gumming, tin planting, pry unloading and other cpu disassembly functions.
Can be used to separate the welding point.