Further Details

Title: System on Package
Condition: New
Format: Hardback
EAN: 9780071459068
ISBN: 9780071459068
Publisher: McGraw-Hill Professional
Release Date: 16/06/2008
Description: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.




System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Language: English
Country/Region of Manufacture: US
Item Height: 241mm
Item Length: 193mm
Item Width: 35mm
Item Weight: 1618g
Author: Rao Tummala
Genre: Technology & Engineering
Release Year: 2008

Missing Information?

Please contact us if any details are missing and where possible we will add the information to our listing.