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Title: System on Package Condition: New Format: Hardback EAN: 9780071459068 ISBN: 9780071459068 Publisher: McGraw-Hill Professional Release Date: 16/06/2008 Description: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. Language: English Country/Region of Manufacture: US Item Height: 241mm Item Length: 193mm Item Width: 35mm Item Weight: 1618g Author: Rao Tummala Genre: Technology & Engineering Release Year: 2008 Missing Information?
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