Steel Reballing Stencil Kit for CPU IC Chip Tin Planting Soldering Template
Description:
brand new and
Feature:
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. in use.
success rate of planting tin, the solder can be formed once when you are proficient. Simple and convenient to use.
It is suitable for XS MAX XS X 8 8 7 7 6S 6S 6 6 5S 5C 5 4S 4 for
BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Size: Standard Size
Color: Silver
for: for XS MAX XS X 8 8 7 7 6S 6S 6 6 5S 5C 5 4S 4 for Optional
Quantity: 1 Pc

Note:
No retail package.
Transition: 1cm=10mm=0.39inch
Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:(Optional)
1 x BGA Reballing Stencils for XS MAX
1 x BGA Reballing Stencils for
1 x BGA Reballing Stencils for XS
1 x BGA Reballing Stencils for X
1 x BGA Reballing Stencils for 8
1 x BGA Reballing Stencils for 8
1 x BGA Reballing Stencils for 7
1 x BGA Reballing Stencils for 7
1 x BGA Reballing Stencils for 6S
1 x BGA Reballing Stencils for 6S
1 x BGA Reballing Stencils for 6
1 x BGA Reballing Stencils for 6
1 x BGA Reballing Stencils for 5S
1 x BGA Reballing Stencils for
1 x BGA Reballing Stencils for 5C
1 x BGA Reballing Stencils for 5
1 x BGA Reballing Stencils for 4S
1 x BGA Reballing Stencils for 4
1 x BGA Reballing Stencils for