Dynatron® R16: 1U Active Copper Heatsink LGA 2011 CPU Cooler With Vapor Chamber For Intel® Xeon® Processors | Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity. What is a Vapor Chamber and how does that help me? A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk. Noteable features include: - Solid copper heatsink with stacked-fins
- Double ball-bearing PWM blower
- Supports 1U+
- Pre-printed thermal compound
- RoHS Compliance
| | Dynatron® R16: 1U Active Copper Heatsink LGA 2011 CPU Cooler With Vapor Chamber For Intel® Xeon® Processors | Manufacturer's P/N: | R16 | Dimensions: | 90 x 90 x 28mm 3.54" x 3.54" x 1.10" (in inches) | CPU Support: | LGA 2011 (Socket R) Sandy Bridge - EP/EX Intel® Core™ i7, Xeon® E5 and other LGA 2011 processors 150W TDP MAX | Features: | Shin-Etsu G751 Thermal Compound (pre-printed) | Blower Specifications: | Dimensions: | 80 x 15mm | Rated Voltage: | 12V | | Duty Cycle 0~20% | Duty Cycle 50% | Duty Cycle 100% | | Speed: | 1000 ±10% RPM | 3500 ±10% RPM | 6000 RPM | | Input Power: | | Air Flow: | 6.5 CFM | 11.2 CFM | 19.1 CFM | | Static Pressure: | 2.27 mm-H2O | 18.56 mm-H2O | 54.5 mm-H2O | | Acoustical Noise: | 21.5 dBA | 43.0 dBA | 55.8 dBA | | | International Shipping Details | - Import taxes, customs duties and all associated fees during importation will be the responsibility of the purchaser.
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