Dynatron R16 1U Active CPU Cooler with Vapor Chamber for Intel LGA 2011


Dynatron® R16: 1U Active Copper Heatsink LGA 2011 CPU Cooler With Vapor Chamber
For Intel® Xeon® Processors

Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the R16 supports a CPU with maximum TDP rating of 150W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The R16 features a double ball-bearing, PWM blower for durability and longevity.

What is a Vapor Chamber and how does that help me?
A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

Noteable features include:

  • Solid copper heatsink with stacked-fins
  • Double ball-bearing PWM blower
  • Supports 1U+
  • Pre-printed thermal compound
  • RoHS Compliance

 


Dynatron® R16: 1U Active Copper Heatsink LGA 2011 CPU Cooler With Vapor Chamber
For Intel® Xeon® Processors
Manufacturer's P/N: R16
Dimensions: 90 x 90 x 28mm
3.54" x 3.54" x 1.10" (in inches)
CPU Support: LGA 2011 (Socket R)
Sandy Bridge - EP/EX
Intel® Core™ i7, Xeon® E5 and other LGA 2011 processors
150W TDP MAX
Features: Shin-Etsu G751 Thermal Compound (pre-printed)
Blower Specifications:
Dimensions: 80 x 15mm
Rated Voltage: 12V
 
Duty Cycle 0~20% Duty Cycle 50% Duty Cycle 100%
Speed:
1000 ±10% RPM 3500 ±10% RPM 6000 RPM
Input Power:
0.60W 3.84W 14.4W
Air Flow:
6.5 CFM 11.2 CFM 19.1 CFM
Static Pressure:
2.27 mm-H2O 18.56 mm-H2O 54.5 mm-H2O
Acoustical Noise:
21.5 dBA 43.0 dBA 55.8 dBA

International Shipping Details
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