Indium 97 silver 3 indium silver In97Ag3 indium silver solder sheet with indium silver solder sheet lead-free low temperature low melting point tin solder sheet

 Product Name: Indium Silver Solder Sheet

Composition: In97Ag3

Melting point: 143 degrees
Our equipment production capacity can manufacture solder tapes with a width of 2-200MM and a thickness of 0.025MM and above. All dimensions depend on the properties of the solder alloy, and can usually be customized to your specifications and alloys, and we can meet your needs.

product description

(1) Preformed welding strips are generally divided into two categories: pre-coated welding strips and high-clean welding strips.

Pre-coated solder sheet refers to coating a layer of solid flux on the pre-formed solder sheet. When used, it can be directly assembled with the device and soldered by heating methods such as reflow soldering or induction soldering. Compared with tin wire or solder paste, the pre-coated solder sheet has the same amount of solder, less flux, which can be controlled at 1% to 5% according to customer requirements, less residue, high reliability, and beautiful solder joints.

(2) High-clean welding tape refers to the surface of the solder sheet without flux, bright surface, extremely low oxidation rate, generally used in formic acid-vacuum furnace process (formic acid/hydrogen/nitrogen+hydrogen N2/H2--95%/ 5%).

Solder selection

1. The alloy should be selected according to the required strength and other characteristics and the withstand temperature of the welded device.

2. Second, consider the materials to be soldered and choose solders that are compatible with them.

3. Metal alloys have different properties. Whether they are easy to make into different shapes and thicknesses depends on the metal and alloy properties.

4. Will the working environment/temperature of the assembly be subject to external vibration? It is also an important factor to consider when choosing an alloy.

Flux Type

In terms of flux selection, our company can provide different active types, which are generally divided into four categories: low active R, medium active RMA, active RA, high active RSA. In applications where residues are strictly controlled, easy-to-solder metal surfaces, such as lead-free/leaded solder, gold, silver, palladium, copper, etc., can be provided with R/RMA level flux coating. In applications with difficult welding, such as nickel, zinc, stainless steel, RA/RSA level flux coating can be provided. Our company's pre-coated solder tabs and fluxes are RoHS compliant.

From the cleaning point of view, it can be divided into: disposable type and water-washable type.

coating amount

For different products, we provide different flux coating amount of 1% to 5%. The coating amount of flux is mainly related to the welding area and the difficulty of welding. Reducing the coating amount on the basis of ensuring the solderability will help to reduce flux residues and solder joint voids and improve the reliability of solder joints.

Coating method

At the same time, the coating method of the flux can also be selected, and we can apply the flux at the same time as manufacturing the solder tab. We can also provide solder tabs without flux, and also provide solid powder flux. Customers can mix solid powder flux with absolute ethanol in a certain ratio (usually 1:4) when needed, and soak the solder tab in In the prepared flux, it can be used after drying.

Advantage

Although the solder tab will increase a certain explicit cost, it has obvious advantages in other aspects, especially in some scenarios where the use of tin wire solder paste is inconvenient, such as slot assembly, large plane welding, etc., or requires less flux residue Occasionally, because the solder paste flux content is 10% to 15%, the residue is a problem, and it is easy to generate large solder joint voids. Since the solder tab has a very stable tin amount and low flux content, the use of pre-coated solder tab assembly has low porosity, less residue, and high reliability.

Be applicable:

It is used for PCB circuit boards, metal shells, metal-glass packages, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, and metal shells or ceramic shells for hermetically sealed packaging of optoelectronic devices.

Generally divided into:

Ultra-thin: 0.025mm, 0.05mm

Thinner: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm

Thicker type: 0.5mm-1.0mm

Thickened type: 1.0mm or more

Width: generally around 50-100mm