Introduction: Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc. It's used in low ionic activator system, tin-run speed Low level of smoke,surface insulation resistance value is high residue after curing Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features: NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR Recommended for BGA, CSP and other solder ball array repair and fill the ball When using smoke less, no residue. Affordable.
Suitable for: North and south bridge, cards, cell phone chip, video chip BGA solder, bumping Also can use off the tin, the effect is very ideal The residue was less bright spot, less smoke, no pungent odor, do not run the ball
Package included:
1 x 100g AMTECH NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease
WE PROMISE YOU CAN GET THE ITEMS YOU PAID OR REFUND.
To USA: Send by e-package. To other countries: Order more than $25, provide free tracking number. Order less than $25,customer can pay $2 to get a tracking number.
We located in the biggest electronic market in China--HQB(Shenzhen) ,Specialist in ICs over 10 years, we seek to establish long-term business relationships.
We appreciate positive feedback . we always try our best to service our customers . so if you
have ant question ,PLEASE DON’T HESITATE TO CONTACT US IMMEDIATEDLY,
we are always here to offer help .
We prefer PayPal .For purchasing multiple items , please contact us for a combined invoice .
generally we would like to receive payment thin 48 hours if .
PLEASE BUY WITH CONFIDENCE
We specialize in electronic components . ICs, Capacitors, Diodes, Resistors, LEDs,
NEW , ORIGINAL parts . please buy with confidence .We offer NO-QUESTION-REFUND
We provide airmail service with good package . The items will be shipped within the nest
2 business days after we received the payment . when you buy multiple items ,your shipping
cost will be combined with discount .
NC-559-ASM
Introduction:
Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.
It's used in low ionic activator system, tin-run speed
Low level of smoke,surface insulation resistance value is high residue after curing
Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.
Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can use off the tin, the effect is very ideal
The residue was less bright spot, less smoke, no pungent odor, do not