Lead Solder Balls Bump BGA Soldering 250K 63/37 0.3mm Diameter
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Descriptions![]() 1 Bottle of BGA Lead Solder Balls 250K 0.3mm for Soldering Repair These solder balls are used for connection of semiconductor chip, circuit module and PCB board. ![]() Lead Solder Balls
We can also supply some materials for BGA reworking/soldering, such as stencils, flux paste, rework station and other needed soldering tools etc. If you need any of them, please feel free to contact us for quotation before purchase. |
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Specifications
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Satisfaction Guaranteed
30 Days Money Back Guarantee
Free Replacement
12 Months Supplier Warranty
Requirements
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